DocumentCode :
2575165
Title :
Sputtering process design of PZT capacitors for stable FeRAM operation
Author :
Inoue, N. ; Takeuchi, T. ; Hayashi, Y.
Author_Institution :
ULSI Res. Lab., NEC Corp., Sagamihara, Japan
fYear :
1998
fDate :
6-9 Dec. 1998
Firstpage :
819
Lastpage :
822
Abstract :
PZT capacitors of Zr/Ti=0.35/0.65 show wide operational margin in FeRAM devices, due to the low coercive voltage and the low dielectric constant. The sputtering of top electrodes, Ir/IrO/sub 2/, in high O/sub 2/ pressure and at low temperature avoids damage to the PZT surface. Optimization of the composition and sputtering conditions for the top electrodes achieved a highly reliable capacitor for FeRAM.
Keywords :
ferroelectric capacitors; ferroelectric storage; lead compounds; permittivity; random-access storage; sputter deposition; zirconium compounds; FeRAM operation; PZT; PZT capacitors; PbZrO3TiO3; coercive voltage; dielectric constant; operational margin; reliable capacitor; sputtering conditions; sputtering process design; top electrodes; Capacitors; Dielectric constant; Electrodes; Ferroelectric films; Low voltage; Nonvolatile memory; Process design; Random access memory; Sputtering; Zirconium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1998. IEDM '98. Technical Digest., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-4774-9
Type :
conf
DOI :
10.1109/IEDM.1998.746481
Filename :
746481
Link To Document :
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