The Design and Realization of Machine Vision System in Flip - chip Bonder

Machine vision scheme and CCD install position are designed to realize the alignment of chip and substrate in the thermosonic flip-chip bonding process. Based on experiments on various color and style LED lights, the single-color LED illumination composed of a ring LED light and some LED lamps are adopted to get a uniform luminance of visual field and clear contours of the object´s surface. The vision software is developed based on HexSight, the conference points are added to models of locator to recognize different objects (chip & substrate). The reasonable control scheme of two CCD cameras is adopted. According to the error of translation and rotation estimated by experiments on many real images, the composite position error of the vision system on scale 1 times 1mm chip is calculated, which indicates the high precision and satisfaction of this vision system in microelectronic packaging