Title :
The Effect of Contact Angle and Solder Bump Arrangement on Underfill Process
Author_Institution :
Dept. of Aeronaut. & Astronaut., National Cheng-Kung Univ., Tainan
Abstract :
This study was devoted to investigate the effects of the contact angle and the bump arrangement on the underfill flow. The Hele-Shaw flow model, that considered the flow resistance in both the thickness direction between the chip and substrate and the plane direction between solder bumps, was assumed. A modified capillary force model including the effects of the contact angle and the bump arrangement was proposed. The capillary force was formulated based on either quadrilateral or hexagonal bump arrangements. A hexagonal arrangement of solder bumps was studied
Keywords :
contact angle; filling; solders; Hele-Shaw flow model; contact angle; flow resistance; hexagonal arrangement; modified capillary force model; solder bump arrangement; underfill flow; underfill process; Contacts; Ducts; Electronic packaging thermal management; Equations; Filling; Joining materials; Permeability; Soldering; Thermal expansion; Thermal stresses;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359734
