Title :
Power Supply Noise Analysis Methodology For Deep-submicron Vlsi Chip Design
Author :
Chen, Howard H. ; Ling, David D.
Author_Institution :
IBM Research Division Thomas J. Watson Research Center Yorktown Heights, NY 10598, U.S.A
Keywords :
Artificial intelligence; Capacitors; Chip scale packaging; Circuit noise; Degradation; Impedance; Noise reduction; Power supplies; Very large scale integration; Wire;
Conference_Titel :
Design Automation Conference, 1997. Proceedings of the 34th
Conference_Location :
Anaheim, CA, USA
Print_ISBN :
0-7803-4093-0
DOI :
10.1109/DAC.1997.597223
