DocumentCode :
2575498
Title :
Filler Contents Effects on the Moisture Absorption and Viscoelasticity of Thermosetting IC Packaging Polymers
Author :
Ma, Xiaosong ; Jansen, K.M.B. ; Zhang, G.Q. ; Ernst, L.J.
Author_Institution :
Delft Univ. of Technol.
fYear :
2006
fDate :
26-29 Aug. 2006
Firstpage :
1
Lastpage :
5
Abstract :
Four types of polymer which were selected are EPN1180 and EPN1180 filled with, 40%, 50%, and 65% fused silica. The moisture absorption is carried out in an adjustable thermal and humidity chamber at different temperature and humidity. The diffusion coefficients at different conditions were obtained through the early stage moisture absorption tests. The moisture absorption was revealed to show the Fickian type of diffusion for four types of samples. In addition the most important issue, the relation between moisture content and filler content is discussed and is revealed. Using this relation, the authors can expect moisture content in the sample with different moisture contents under different temperature and relative humidity conditions. Another issue, the relation between the viscoelasticity and filler content, is revealed. The authors find that the filler has a great effect on the viscoelasticity. The storage modulus is increased 30% by adding 65wt% fused silica
Keywords :
filler metals; humidity; integrated circuit packaging; polymers; viscoelasticity; EPN1180; Fickian type; filler contents effects; fused silica; integrated circuit packaging polymers; moisture absorption; relative humidity conditions; storage modulus; thermosetting; viscoelasticity; Absorption; Elasticity; Humidity; Integrated circuit packaging; Moisture; Polymers; Silicon compounds; Temperature; Testing; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
Type :
conf
DOI :
10.1109/ICEPT.2006.359738
Filename :
4198859
Link To Document :
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