Title :
Board Level Drop Test Reliability for MCP Package
Author :
Zhang, Jing ; Du, Maohua ; Feng, Nufeng ; Lee, Taekoo
Author_Institution :
Samsung Semicond. R&D Co. Ltd., Suzhou
Abstract :
With the increasing requirement of thinner, higher density and multi-function product, MCP (multi chip package) is becoming a more and more popular package. And for application in handheld systems, the package´s resistance to drop impact becomes especially important. This study uses a simple DAQ system for the drop test according to JEDEC standard, discusses the effects of substrate pad denting, solder ball composition, and mold thickness on the reliability life, and through failure analysis the failure mechanism is explained
Keywords :
ball grid arrays; failure analysis; impact testing; integrated circuit reliability; multichip modules; DAQ system; JEDEC standard; board level drop test reliability; drop impact; failure analysis; failure mechanism; handheld systems; mold thickness; multi chip package; solder ball composition; substrate pad denting; Costs; Data acquisition; Electronic equipment testing; Electronics packaging; Failure analysis; Packaging machines; Semiconductor device packaging; Stress; System testing; Test equipment;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359759
