Drop Test Failure Analysis of SAC BGA Solder Joints Using Ni/Au and Cu-OSP Pad Finish

Author

Xie, Xiaoqiang ; Wang, Lei ; Lee, Taekoo

Author_Institution

Samsung Semicond. (China) R&D Co. Ltd, Suzhou

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

4

Abstract

The Sn3.0Ag0.5Cu solder joints with a 500mum diameter on the Ni/Au and Cu-OSP pad finish were tested in board level drop test defined by the JESD22-B111. 100, 300 and 500 hours HTS(high temperature storage) test at 125 degC were performed to evaluate the drop test life during aging. The IMC morphology during aging was investigated. For different pad finish, the drop failure mechanism was studied before and after HTS test. For OSP pad finish, a Cu₃Sn layer with Kirkendall voids was thought to be the main failure factor during drop test. IMC thickness was thought not to be a key factor for drop test life

Keywords

ball grid arrays; copper alloys; failure analysis; gold alloys; life testing; nickel alloys; solders; tin alloys; voids (solid); 100 to 500 hours; 125 C; 500 micron; Cu-OSP pad finish; Cu₃Sn; IMC morphology; Kirkendall voids; Ni-Au; SAC BGA solder joints; SnAgCu; drop failure mechanism; drop test failure analysis; high temperature storage test; Aging; Circuit testing; Failure analysis; Gold; High temperature superconductors; Life testing; Morphology; Performance evaluation; Semiconductor device testing; Soldering;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359772

Filename

4198893