DocumentCode :
2576072
Title :
Study on Improvement of Thermal and Mechanical Properties of PEEK-Modified Epoxy Resins
Author :
Hu, Bing ; Zeng, Liming ; Hu, Chuanqun ; Meng, Dongbing
Author_Institution :
Sch. of Mater. Sci. & Eng., Wuhan Univ. of Technol.
fYear :
2006
fDate :
26-29 Aug. 2006
Firstpage :
1
Lastpage :
5
Abstract :
In the paper, PEEK(poly(ether ether ketone)) was added to the epoxy resins as a modifier to improve thermal and mechanical properties of the cured resins. The heat effects of curing epoxy resin composites with PEEK were investigated by differential scanning calorimetry (DSC) technology and the morphologies of the fracture surface by scanning electron microscope (SEM). The relationship between the morphologies and mechanical properties were discussed. The results revealed that the thermal and mechanical properties of the modified epoxy resins, such as impact strengths, compress strengths and the flexural strengths achieved improvements to a certain extent, compared with those of neat epoxy resins. As the addition of PEEK is 6 wt%, the impact strength reaches the maximum of 19.1kJ/m2, Martin´s temperature achieves 120degC
Keywords :
curing; differential scanning calorimetry; mechanical properties; resins; scanning electron microscopy; surface morphology; thermal properties; 120 C; DSC technology; SEM; differential scanning calorimetry technology; epoxy resin composites; fracture surface morphologies; heat effects; mechanical properties; polyether ether ketone; scanning electron microscope; thermal properties; Curing; Epoxy resins; Materials science and technology; Mechanical factors; Morphology; Resistance heating; Scanning electron microscopy; Testing; Thermal engineering; Viscosity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
Type :
conf
DOI :
10.1109/ICEPT.2006.359780
Filename :
4198901
Link To Document :
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