• DocumentCode
    2576072
  • Title

    Study on Improvement of Thermal and Mechanical Properties of PEEK-Modified Epoxy Resins

  • Author

    Hu, Bing ; Zeng, Liming ; Hu, Chuanqun ; Meng, Dongbing

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Wuhan Univ. of Technol.
  • fYear
    2006
  • fDate
    26-29 Aug. 2006
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    In the paper, PEEK(poly(ether ether ketone)) was added to the epoxy resins as a modifier to improve thermal and mechanical properties of the cured resins. The heat effects of curing epoxy resin composites with PEEK were investigated by differential scanning calorimetry (DSC) technology and the morphologies of the fracture surface by scanning electron microscope (SEM). The relationship between the morphologies and mechanical properties were discussed. The results revealed that the thermal and mechanical properties of the modified epoxy resins, such as impact strengths, compress strengths and the flexural strengths achieved improvements to a certain extent, compared with those of neat epoxy resins. As the addition of PEEK is 6 wt%, the impact strength reaches the maximum of 19.1kJ/m2, Martin´s temperature achieves 120degC
  • Keywords
    curing; differential scanning calorimetry; mechanical properties; resins; scanning electron microscopy; surface morphology; thermal properties; 120 C; DSC technology; SEM; differential scanning calorimetry technology; epoxy resin composites; fracture surface morphologies; heat effects; mechanical properties; polyether ether ketone; scanning electron microscope; thermal properties; Curing; Epoxy resins; Materials science and technology; Mechanical factors; Morphology; Resistance heating; Scanning electron microscopy; Testing; Thermal engineering; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0619-6
  • Electronic_ISBN
    1-4244-0620-X
  • Type

    conf

  • DOI
    10.1109/ICEPT.2006.359780
  • Filename
    4198901