DocumentCode
2576072
Title
Study on Improvement of Thermal and Mechanical Properties of PEEK-Modified Epoxy Resins
Author
Hu, Bing ; Zeng, Liming ; Hu, Chuanqun ; Meng, Dongbing
Author_Institution
Sch. of Mater. Sci. & Eng., Wuhan Univ. of Technol.
fYear
2006
fDate
26-29 Aug. 2006
Firstpage
1
Lastpage
5
Abstract
In the paper, PEEK(poly(ether ether ketone)) was added to the epoxy resins as a modifier to improve thermal and mechanical properties of the cured resins. The heat effects of curing epoxy resin composites with PEEK were investigated by differential scanning calorimetry (DSC) technology and the morphologies of the fracture surface by scanning electron microscope (SEM). The relationship between the morphologies and mechanical properties were discussed. The results revealed that the thermal and mechanical properties of the modified epoxy resins, such as impact strengths, compress strengths and the flexural strengths achieved improvements to a certain extent, compared with those of neat epoxy resins. As the addition of PEEK is 6 wt%, the impact strength reaches the maximum of 19.1kJ/m2, Martin´s temperature achieves 120degC
Keywords
curing; differential scanning calorimetry; mechanical properties; resins; scanning electron microscopy; surface morphology; thermal properties; 120 C; DSC technology; SEM; differential scanning calorimetry technology; epoxy resin composites; fracture surface morphologies; heat effects; mechanical properties; polyether ether ketone; scanning electron microscope; thermal properties; Curing; Epoxy resins; Materials science and technology; Mechanical factors; Morphology; Resistance heating; Scanning electron microscopy; Testing; Thermal engineering; Viscosity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0619-6
Electronic_ISBN
1-4244-0620-X
Type
conf
DOI
10.1109/ICEPT.2006.359780
Filename
4198901
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