Effects of Bonding Parameters on the Lighting Performance of High Power LEDs Fabricated by Thermosonic Flip Chip Bonding

LED technology has flourished for the past few decades. Under the rapid development of new LED industry, thermosonic flip chip bonding is considered as a quite useful fabrication method to manufacture the high power and high brightness LEDs. The effects of bonding parameters of thermosonic flip chip on the lighting performance of LEDs were surveyed in this paper. Since the thermosonic flip chip bonding process consists of three main parameters which involving substrate heating temperature, bonding force and ultrasonic power, the experiments were performed by altering these parameters. To study the relationship between the bonding parameters and lighting performance, flip chip LEDs was tested with a probing machine and a LED tester. The test results were recorded by a computer connected with the tester. By analyzing the data, similar trends of lighting intensity and domain wavelength under different bonding parameters were observed, and concrete effects of these parameters on the lighting performance of high power LEDs fabricated by thermosonic flip chip bonding were concluded