The Study of Ball Attach Strength for CBGA Packages

Author

Zhang, Xiaojun ; Fu, Hualiang ; Zheng, Hongyu ; Zhang, Jinli

Author_Institution

Hebei Semicond. Res. Inst., Shijiazhuang

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

3

Abstract

Future applications require higher I/O counts, more densification, and greater performance. CBGA(ceramic ball grid array) packages are appropriate to this demand. As it is well known, the distribution of I/O contacts in CBGA is made on the surface of the ceramic substrate, following a metric group geometry. The connections have a ball shape and are made with a Sn10Pb90 alloy characterized by an high fusion temperature; this balls are attached on the package metallization using the classical Sn63Pb37 alloy. After assembling, the connection appears as a Sn10Pb90 ball embedded in a Sn63Pb37 joint linking the package metallization and the PCB pads. The attach strength of the balls influence a lot on assembling reliability. In this paper, the higher leaded balls attach strength of CBGA packages are studied through experimental programs. The factors include: ceramic pads geometry, stencil thickness, plated metals, reflow process, high temperature storage time, etc

Keywords

ball grid arrays; ceramic packaging; lead alloys; metallisation; reflow soldering; tin alloys; CBGA packages; PCB pads; SnPb; assembling reliability; ball attach strength; ceramic ball grid array packages; ceramic pads geometry; ceramic substrate; high fusion temperature; high temperature storage time; package metallization; plated metals; reflow process; stencil thickness; Ceramics; Copper; Geometry; Gold; Nickel; Semiconductor device packaging; Substrates; Temperature; Tin; Tungsten;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359784

Filename

4198905