Title :
Precise Measurement of the Wafer Circuit Width Using Computer Vision
Author :
Wang, Guitang ; Liu, Runyu ; Wu, Liming ; Deng, Yaohua
Author_Institution :
Sch. of Inf. Eng., Guangdong Univ. of Technol., Guangzhou
Abstract :
A method of measuring the two-dimension and nanowidth of wafer with fast speed and high precision level of sub-pixel width is offered in this paper. This method takes two steps: Firstly, utilizing the standard ruler to fast measure the pending size with per-pixel level of precision; secondly, utilizing the technology of spatial moment pixel subdivision to precisely locate the edge pixels of pending graph, achieving subpixel level of precision. We apply this method to measure and validate one welding-plate among the wafers. The result indicates that the measuring precision has been improved significantly and it can satisfy the requirement of the wafer´s CD measurement and calibration
Keywords :
computer vision; electronic engineering computing; integrated circuit measurement; computer vision; spatial moment pixel subdivision; standard ruler; wafer CD calibration; wafer CD measurement; wafer circuit width precise measurement; welding-plate; Calibration; Circuits; Computer vision; Length measurement; Manufacturing processes; Measurement standards; Microscopy; Pixel; Size measurement; Velocity measurement; calibrationl; spatial moment; standard ruler; sub-pixel; wafer;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359793
