Precise Measurement of the Wafer Circuit Width Using Computer Vision

Author

Wang, Guitang ; Liu, Runyu ; Wu, Liming ; Deng, Yaohua

Author_Institution

Sch. of Inf. Eng., Guangdong Univ. of Technol., Guangzhou

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

5

Abstract

A method of measuring the two-dimension and nanowidth of wafer with fast speed and high precision level of sub-pixel width is offered in this paper. This method takes two steps: Firstly, utilizing the standard ruler to fast measure the pending size with per-pixel level of precision; secondly, utilizing the technology of spatial moment pixel subdivision to precisely locate the edge pixels of pending graph, achieving subpixel level of precision. We apply this method to measure and validate one welding-plate among the wafers. The result indicates that the measuring precision has been improved significantly and it can satisfy the requirement of the wafer´s CD measurement and calibration

Keywords

computer vision; electronic engineering computing; integrated circuit measurement; computer vision; spatial moment pixel subdivision; standard ruler; wafer CD calibration; wafer CD measurement; wafer circuit width precise measurement; welding-plate; Calibration; Circuits; Computer vision; Length measurement; Manufacturing processes; Measurement standards; Microscopy; Pixel; Size measurement; Velocity measurement; calibrationl; spatial moment; standard ruler; sub-pixel; wafer;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359793

Filename

4198914