Understanding the Cost Effectiveness of Embedded Technology

Embedding is a common technology for miniaturization or performance improvement. In some cases, embedding also provides an overall product cost reduction. However, embedding on the wrong design or choosing the wrong technology can be a cost disaster. In this paper, we discuss the size and cost trade-offs of embedding and give guidance to help you assess whether embedding is right for you. One effective approach for miniaturization is embedding circuit functionality in the board as opposed to placing components on the board. While there are a number of different embedding technologies, they can all be divided into two major categories. "Embedded passives" is a term which usually refers to the fabrication of passive devices such as resistors, capacitors, or inductors as part of the overall board fabrication process. "Embedded actives", or more accurately "embedded discrete components", refers to placing discrete components (usually either discrete passives or bare die) in the board prior to final lamination. Both technologies achieve the same size reduction by eliminating components on the surface of the board, but differ in their costs and cost drivers. In this paper we will consider the advantages and disadvantages of embedded actives, embedded discrete passives, thin film fabricated passives, and thick film fabricated passives.