Title :
Embedded Capacitor Technology: A Real World Example
Author :
Smith, Norm ; Fan, Jun ; Andresakis, John ; Fukawa, Yoshi ; Harvey, Mark ; Knighten, Jim
Author_Institution :
Teradata Corp., Dayton, OH
Abstract :
Embedding capacitive layers inside the printed circuit board (PCB) have demonstrated the ability to reduce the number of surface mount technology (SMT) chip decoupling capacitors on the PCB surface as well as greatly improve the performance of the power distribution system. Many systems today utilize this technology, but most public information is limited to data on test vehicles or emulators. This paper utilizes simulated as well as measured product data to compare the performance of the standard design to one using various types of buried capacitance layers with a reduced number of SMT decoupling capacitors. A methodology is provided that can be utilized for other designs.
Keywords :
capacitors; printed circuits; surface mount technology; chip decoupling capacitors; embedded capacitor; power distribution system; printed circuit board; surface mount technology; Capacitance measurement; Capacitors; Circuit testing; Measurement standards; Power distribution; Printed circuits; Semiconductor device measurement; Surface-mount technology; System testing; Vehicles;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-1335-5
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2007.4417064