Title :
Optimization Of Nickel Thickness On Substrate For TBGA Using SAC387 Solder Material
Author :
Ahmad, Ibrahim ; Majlis, B.Y. ; Jalar, A. ; Leng, Eu Poh
Author_Institution :
Adv. Semicond. Packaging (ASPAC) Lab., Univ. Kebangsaan Malaysia, Bangi
Abstract :
The purpose of this paper is to discuss the effect of Nickel (Ni) thickness on lead free solder joint material for tape ball grid array (TBGA) application. In this study, four different level of Nickel thickness were chose that is 3 um, 4 um, 5 um and 6 um. Ball pull testing was used to assess the solder joint performance at time zero, after multiple reflow and high temperature storage (HTS). The machine that was used for the ball pull test is Dage 4000 series. A design of experiment (DOE) based approach is used to study and understand ball pull strength data based on effect of Ni thickness. Statistical results performed shows that 4 um is the most preferred thickness for the Ni layer, thus giving a significant effect, supported by thinner Intermetallic layer thickness and area.
Keywords :
ball grid arrays; copper; copper alloys; design of experiments; nickel; optimisation; silver alloys; solders; tin alloys; Cu; Ni-Cu-SnAgCu; SAC387 solder material; ball pull strength; design of experiment; high temperature storage; multiple reflow; nickel thickness; optimization; size 3 mum; size 4 mum; size 5 mum; size 6 mum; tape ball grid array; Electronics packaging; Environmentally friendly manufacturing techniques; High temperature superconductors; Intermetallic; Joining materials; Lead; Nickel; Soldering; Testing; US Department of Energy;
Conference_Titel :
Electronic Manufacturing Technology Symposium, 2007. IEMT '07. 32nd IEEE/CPMT International
Conference_Location :
San Jose, CA
Print_ISBN :
978-1-4244-1335-5
Electronic_ISBN :
1089-8190
DOI :
10.1109/IEMT.2007.4417067
