DocumentCode
2576500
Title
The Design and Fabrication of Microlens and LED Integrated Packaging
Author
Wang, Dianming ; Chen, Sihai ; Wang, Ming ; Xiang, Sihua
Author_Institution
Inst. of Optoelectronic Sci. & Eng., Huazhong Univ. of Sci. & Technol., Wuhan
fYear
2006
fDate
26-29 Aug. 2006
Firstpage
1
Lastpage
3
Abstract
Conventional LED packaging structures do not take into account the output light properties very well. Based on microelectromechanical system (MEMS) technology, a method of microlens and LED integrated packaging is presented, which can enormously enhance output optical extraction efficiency, and improve the output optical performance. It is easy to realize mass production by the method
Keywords
electronics packaging; light emitting diodes; microlenses; micromechanical devices; LED integrated packaging; microelectromechanical system technology; microlens design; microlens fabrication; optical extraction efficiency; Lenses; Light emitting diodes; Mass production; Micromechanical devices; Microoptics; Optical design; Optical device fabrication; Optical refraction; Packaging; Stimulated emission; Integrated packaging; LED; MEMS; Microlens;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0619-6
Electronic_ISBN
1-4244-0620-X
Type
conf
DOI
10.1109/ICEPT.2006.359803
Filename
4198924
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