Title :
Fluorinated Aromatic Polyimides for Advanced Microelectronics Packaging Applications
Author :
Yang, Haixia ; Xu, Hongyan ; Tao, Zhiqiang ; Fan, Lin ; Yang, Shiyong
Author_Institution :
Inst. of Chem., Chinese Acad. of Sci., Beijing
Abstract :
A series of novel fluorinated polyimides have been synthesized by the polycondensation of 4,4´-oxydiphthalic dianhydride (ODPA) with 1,4-bis(4-amino-2-trifluoromethyl-phenoxy) benzene (6FAPB) and 4,4´-bis(4-amino-2-trifluoro-methylphenoxy) biphenyl (6FBPB) in the presence of phthalic anhydride (PA), or phenylethynyl phthalic anhydride (PEPA) as molecular weight-controlling and end-capping agents. The molecular weight-controlled fluorinated aromatic polyimides showed great solubility in organic solvents and good melt ability at elevated temperatures. Thus, glass fiber-reinforced polyimide laminates have been fabricated by thermally curing the B-staged glass/polyimide prepregs which was prepared by impregnating polyimide solution on glass fiber cloths followed by thermal baking. Experimental results demonstrated that the glass/PI laminates exhibited great thermal stability and good mechanical properties
Keywords :
condensation; electronics packaging; integrated circuit packaging; polymers; 1,4-bis(4-amino-2-trifluoromethyl-phenoxy) benzene; 4,4´-bis(4-amino-2-trifluoro-methylphenoxy) biphenyl; 4,4´-oxydiphthalic dianhydride; B-staged glass; end-capping agents; glass fiber cloths; glass fiber-reinforced polyimide laminates; microelectronics packaging; molecular weight-controlled fluorinated aromatic polyimides; molecular weight-controlling; organic solvents; phenylethynyl phthalic anhydride; polycondensation; polyimide prepregs; polyimide solution; thermal baking; thermal curing; thermal stability; Curing; Glass; Laminates; Mechanical factors; Microelectronics; Packaging; Polyimides; Solvents; Temperature; Thermal stability; Fluorinated polyimide; Mechanical Property; Melt processability;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359805
