Title :
Fully Cure-Dependent Modeling and Characterization of EMC´s with Application to Package Warpage Simulation
Author :
Ernst, L.J. ; Jansen, K.M.B. ; Saraswat, M. ; van ´t Hof, C. ; Zhang, G.Q. ; Yang, D.G. ; Bressers, H.J.L.
Author_Institution :
Delft Univ. of Technol.
Abstract :
In order to establish the possible influence of residual stress-and strain fields after cure on the failure prediction of electronic packages, cure-dependent viscoelastic constitutive relations for the applied polymers are required. This paper gives an overview of progress in the field of viscoelastic modeling and characterization of applied polymers over the past few years. It also discusses limitations and needs for future development
Keywords :
electromagnetic compatibility; electronics packaging; internal stresses; EMC; electronic packages; failure prediction; fully cure dependent modeling; package warpage simulation; residual stress; strain fields; viscoelastic modeling; Capacitive sensors; Curing; Elasticity; Electromagnetic compatibility; History; Packaging; Polymers; Stress; Temperature dependence; Viscosity;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359808
