Research on Manufacture Process of Thin Film RC Network Integrated Circuit Based on CSP Technique

This paper puts forward a new structure of packaging of the RC network integrated circuit (IC) based on CSP (chip scale packaging) technique, and introduces in detail the entire packaging process. Meanwhile, we have done experiments on the reliability of the packaging, and proved that RC network IC based on FCCSP (flip chip CSP) has a large advantage over discrete devices in the demand of high-density and high-performance circuits, and improves to a large extent in terms of reducing packaging area and parasites. Moreover, through tests on performance of the devices, it is proved that RC network IC based on CSP technique sees a less insertion loss in high frequency section