Numerical Simulation and Analysis for a New Thermal Conduction Scheme in Chip-on-Chip SiP

System-in-package (SiP) provides an approach of multi-chip module (MCM), which encapsulates two or more chips in one system in order to realize smaller and lighter packaging size. A typical model SiP made of three-layer chips is studied in the paper. The model system is modified by attaching copper layers which take the advantage of its thermal dissipation and then finite element analyses are conducted to investigate the thermal-mechanical performance of the modified model. The performance between the modified model and other models is also compared by the analyses. The distribution of temperature investigated in the numerical simulation which is considered with the modified model shows that there have been a lower maximum temperature and a uniform distribution of temperature than that in the traditional model. It gives some advices to optimize thermal management of the packaging of the system. In the paper, the results of the analyses demonstrate the new thermal conduction scheme, chip-cooling-laminate-chip (CCLC), is a reasonable method for making better thermal management of the multi-chip system, and it supports the high reliability and low cost resolution in micro-machine, especially in micro medical and other high reliability instruments