DocumentCode
2577090
Title
The Innovative Research of Integrating Electromagnetic Shield into Three-Dimensional Circuit
Author
Wang, Xu ; Wang, Hai
Author_Institution
Coll. of Inf. Sci. & Eng., Northeastern Univ., Shenyang
fYear
2006
fDate
26-29 Aug. 2006
Firstpage
1
Lastpage
7
Abstract
The word "innovative" in title is the new thought to measure the electromagnetic shielding capability level of circuit. Circuits were classified into non-shielding circuits, semi-shielding circuits and shielding circuits. What\´s more, a circuit was really produced and was tested in different shielding levels, and the result was analyzed. It was obvious, and proved that it was important to design the structure and configuration of the electromagnetic shield for delicate circuit, to design the three-dimensional configuration of circuit, to emplace three-dimensional positions of circuit components, to tightly pack circuit with electromagnetic shield. And nowadays, the electromagnetic circumstances are becoming more and more complicated. Hence the application of shielding circuit plays a significant role in the stability improvement of the circuit, especially of the highly subtle circuit
Keywords
circuit stability; electromagnetic shielding; electronic equipment testing; electronics packaging; 3D circuit; circuit stability improvement; delicate circuit; electromagnetic shielding capability; highly subtle circuit; innovative research; shielding circuit; tightly pack circuit; Circuit stability; Circuit testing; Educational institutions; Electromagnetic compatibility; Electromagnetic measurements; Electromagnetic radiation; Electromagnetic shielding; Electronic equipment; Information science; Integrated circuit measurements;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0619-6
Electronic_ISBN
1-4244-0620-X
Type
conf
DOI
10.1109/ICEPT.2006.359841
Filename
4198962
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