DocumentCode
2577182
Title
Metal filling in deep nano trenches/holes using supercritical carbon dioxide
Author
Kondoh, Eiichi
Author_Institution
Interdisciplinary Graduate Sch. of Med. & Eng., Yamanashi Univ., Kofu, Japan
fYear
2003
fDate
29-31 Oct. 2003
Firstpage
42
Lastpage
43
Abstract
This paper reports the deep Cu filling process. Deposition of Ru is also presented. The Cu filling capability was found to greatly depend on the precursor. When Cu/sup II/(dibm)/sub 2/ was used instead of Cu/sup II/(hfac)/sub 2/, a significant improvement in the deep via filling capability under the same deposition conditions was observed.
Keywords
chemical vapour deposition; copper; filling; metallisation; ruthenium; Cu; Ru; Ru deposition; chemical vapour deposition; deep Cu filling; metal filling; metallisation; nano trenches/holes; Biomedical imaging; Carbon dioxide; Ferroelectric materials; Filling; Metallization; Plasma temperature; Surface tension; Temperature distribution; Tin; Ultra large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2003. Digest of Papers. 2003 International
Conference_Location
Tokyo, Japan
Print_ISBN
4-89114-040-2
Type
conf
DOI
10.1109/IMNC.2003.1268509
Filename
1268509
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