Study on the Board Level Reliability of Lead-free PBGA Packages

Author

Kang, Xuejing ; Li, Yujun ; Yang, D.G. ; Qin, L.C.

Author_Institution

Dept. of Mech. Eng., Guilin Univ. of Electron. Technol.

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

5

Abstract

In this paper, a finite element modeling of lead and lead-free soldered PBGA package was performed. The inelastic stress and strain of the solder joints in the PBGA package under thermal cycling has been analyzed. The Garofalo-Arrheninus model was applied to describe the steady-state creep for the solders at high temperatures. The high-low temperatures extreme point, plastic strain, creep strain were analyzed in thermal cycling simulations. Various solder joint fatigue life was calculated by modified Coffin-Masson fatigue life prediction model. Finally, the fatigue life of three different solders in PBGA is compared

Keywords

ball grid arrays; creep; fatigue; finite element analysis; plastic deformation; plastic packaging; reliability; solders; stress-strain relations; Coffin-Masson fatigue life prediction; Garofalo-Arrheninus model; PBGA packages; ball grid arrays; board level reliability; creep strain; finite element modeling; inelastic strain; inelastic stress; plastic strain; solder joint fatigue life; thermal cycling; Capacitive sensors; Creep; Environmentally friendly manufacturing techniques; Fatigue; Finite element methods; Lead; Packaging; Soldering; Temperature; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359849

Filename

4198970