• DocumentCode
    2577238
  • Title

    Two-dimensional micro conveyer with integrated electrostatic actuators

  • Author

    Edo, M. ; Watanabe, Y. ; Morita, O. ; Nakazawa, H. ; Yonezawa, E.

  • Author_Institution
    Functional Device Lab., Fuji Electr. Corp. Res. & Dev. Ltd., Yokosuka, Japan
  • fYear
    1999
  • fDate
    21-21 Jan. 1999
  • Firstpage
    43
  • Lastpage
    48
  • Abstract
    In this paper, we present a two-dimensional micro-conveyer that utilizes electrostatic force. This conveyer with integrated electrostatic actuators is able to convey an object weighing several milligrams with high precision. The actuators are 350/spl times/350 /spl mu/m/sup 2/ in area and are constructed from support beams, an oscillating mass and a conveyance tip above the mass. The actuators are fabricated by a process consisting of the steps of photoresist and photosensitive polyimide lithography, electroplating, and a photoresist sacrificial layer process. The maximum horizontal displacement was 0.2 /spl mu/m at the maximum vertical displacement of 6.7 /spl mu/m with a drive frequency of 10 Hz and applied voltage of 300 V. A silicon chip of 1.4/spl times/1.4 mm in area and 1.4 mg of weight can be conveyed in a two-dimensional direction.
  • Keywords
    conveyors; electroplating; electrostatic actuators; etching; micromachining; micromanipulators; photoresists; 2D micro conveyer; 300 V; 350 micron; conveyance tip; electroplating; high precision conveying; integrated electrostatic actuators; maximum horizontal displacement; maximum vertical displacement; micromanipulation; oscillating mass; photoresist sacrificial layer process; photosensitive polyimide lithography; process flow; seed layer etching; support beams; Cities and towns; Drives; Electrodes; Electrostatic actuators; Frequency; Lithography; Research and development; Resists; Silicon; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
  • Conference_Location
    Orlando, FL, USA
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5194-0
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1999.746749
  • Filename
    746749