Numerical and Experimental Study on Solder Joint Self-Alignment Behavior for Optical Fiber Attachment Assembly

The self-alignment motion of optical fiber is critical to the low-cost and high-precision direct-coupling technology in optoelectronic packaging. First, the mathematical model has been created based on the minimum surface energy principle of solder joint system. Then, the influences of material and solder joint design parameter on the restoring torque have been investigated. Furthermore, based on the self-alignment mechanism analysis of solder joint the brass wire and solder paste has been used to examine the self-alignment behavior. The results show that solder joint with ellipse pad substrate demonstrates smaller alignment error than those with diamond or square pad substrate