The Innovative Research of Integrating Temperature-Controlling Microcirculation System into Three-Dimensional Circuit

Traditional circuit production is mainly flat-style. With rapid raise of circuit´s scale and complexity, traditional style cannot meet the demand of modern electronic industry. 3D (three dimensional) style production make a figure. But the problem of circuit thermal emission follows right away. 3D circuit cannot emit heat naturally. Traditional cooling equipments can only affect the surface but not the inner of the circuit, therefore cannot solve the problem of cooling at all, much less control temperature. Without approach of thermal emission, the circuit will burnt, much less operation normally. Therefore, the author endeavored to quest for the new method, integrated the temperature-controlling microcirculation system into 3D circuit, then traditional circuit and cooling equipments incorporated. Not only the production line was cut short to half, but also the problem of compatibility between two types of equipments was avoided, hence circuit worked more stable. The function of temperature-controlling was appended into the temperature-controlling microcirculation system. It can not only cool the circuit of high temperature, but also heat the circuit operating in a cold environment, and the temperature controlling was uniform, instant and effective