DocumentCode
2577470
Title
Design of Lead-Frame Driving Mechanical Structure of Die Bonder
Author
Li, Ketian ; Chen, Xin ; Wu, Xiaohong ; Wang, Xiaochu ; Gao, Jian
Author_Institution
Sch. of Mech. & Electr. Eng., Guangdong Univ. of Technol., Guangzhou
fYear
2006
fDate
26-29 Aug. 2006
Firstpage
1
Lastpage
3
Abstract
It was discussed the lead-frame driving structure moving along straight rail intermittently, especially the 3D cam in the designed die bonder. The driving part was controlled to fulfil scheduled moving rule by the curve of the 3D contour in the XY plane and Z directions. The contact structure was designed as two side slopes where contacted with the moving part of the 3D cam, by which the branched wrist rack could be forced by the two slopes and Z direction. In addition, the branched wrist could rotate around its geometry center axle, adjusting the contact state between the rollers and the cam surface automatically, to suit the turning movement of the slope contour of the 3D cam. The conveyor system could make the indexer insert the lead-frame, move forward, locate laterally, move back slight, exit from the lead-frame, and return to the start point in a circulation manner
Keywords
drives; integrated circuit manufacture; microassembling; servomotors; branched wrist; contact structure; die bonder; lead-frame driving mechanical structure; Axles; Bonding; Circuit testing; Friction; Geometry; Motion control; Servomechanisms; Servomotors; Space technology; Wrist;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0619-6
Electronic_ISBN
1-4244-0620-X
Type
conf
DOI
10.1109/ICEPT.2006.359860
Filename
4198981
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