• DocumentCode
    2577470
  • Title

    Design of Lead-Frame Driving Mechanical Structure of Die Bonder

  • Author

    Li, Ketian ; Chen, Xin ; Wu, Xiaohong ; Wang, Xiaochu ; Gao, Jian

  • Author_Institution
    Sch. of Mech. & Electr. Eng., Guangdong Univ. of Technol., Guangzhou
  • fYear
    2006
  • fDate
    26-29 Aug. 2006
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    It was discussed the lead-frame driving structure moving along straight rail intermittently, especially the 3D cam in the designed die bonder. The driving part was controlled to fulfil scheduled moving rule by the curve of the 3D contour in the XY plane and Z directions. The contact structure was designed as two side slopes where contacted with the moving part of the 3D cam, by which the branched wrist rack could be forced by the two slopes and Z direction. In addition, the branched wrist could rotate around its geometry center axle, adjusting the contact state between the rollers and the cam surface automatically, to suit the turning movement of the slope contour of the 3D cam. The conveyor system could make the indexer insert the lead-frame, move forward, locate laterally, move back slight, exit from the lead-frame, and return to the start point in a circulation manner
  • Keywords
    drives; integrated circuit manufacture; microassembling; servomotors; branched wrist; contact structure; die bonder; lead-frame driving mechanical structure; Axles; Bonding; Circuit testing; Friction; Geometry; Motion control; Servomechanisms; Servomotors; Space technology; Wrist;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0619-6
  • Electronic_ISBN
    1-4244-0620-X
  • Type

    conf

  • DOI
    10.1109/ICEPT.2006.359860
  • Filename
    4198981