• DocumentCode
    2577485
  • Title

    Design and fabrication of an integrated three-dimensional tactile sensor for space robotic applications

  • Author

    Tao Mei ; Yu Ge ; Yong Chen ; Lin Ni ; Wei-Hsin Liao ; Yangsheng Xu ; Li, W.J.

  • fYear
    1999
  • fDate
    21-21 Jan. 1999
  • Firstpage
    112
  • Lastpage
    117
  • Abstract
    An integrated three-dimensional tactile sensor with robust structure and soft contact surface suitable for space robotic applications was developed. The sensor has a maximum force range of 50 N in the vertical direction and /spl plusmn/10 N in the x-y horizontal directions. The sensitivity of the sensor cells in the vertical direction is 13 m V/V and in the x and y horizontal directions are both 2.3 mV/N. The tactile sensor includes 4/spl times/8 sensing cells each exhibiting an independent linear response to the three components of forces. Post bulk-micromachining was performed on foundry fabricated CMOS chips to produce the sensor cells. With neural network training, the tactile sensor produced reliable 3-axes force measurements and repeatable response on tactile images. Design analysis, fabrication procedures, and experimental results are presented in this paper.
  • Keywords
    CMOS integrated circuits; aerospace robotics; elemental semiconductors; microsensors; silicon; tactile sensors; 3-axes force measurement; Si; contact surface; design analysis; fabrication; foundry fabricated CMOS chips; integrated three-dimensional tactile sensor; neural network training; post bulk-micromachining; repeatable response; sensor cells; space robotic applications; CMOS image sensors; Fabrication; Force measurement; Force sensors; Foundries; Neural networks; Orbital robotics; Robot sensing systems; Robustness; Tactile sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
  • Conference_Location
    Orlando, FL, USA
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5194-0
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1999.746781
  • Filename
    746781