Effect of the Properties of Gold Wire on the Ability of Low-looped Wire Bonding

With the advents and applications of modern packages that employ very thin, die stacking or multi-tiered technologies, low-looped wire bonding with conventional gold wire attracted more attentions. The effect of the size and type of gold wire on the bonding quality, low-looped ability were studied and analyzed. After the serial experiments, such as ball pull test, ball shear test, HAZ length measurement, on the bonding ability of 0.6~1.2 mil gold wire , it could be found that larger gold wire diameter could achieve better mechanical performance, smaller electrical resistance, and longer HAZ which worsens the low-looped ability. Under the integrated and compromised consideration on material cost, mechanical performance, low-looped ability and electrical property of different size gold wire, 1.0 mil gold wire was recommended. Finally the compare tests including ball pull test, ball shear test, HAZ height test and KOH cratering test on the 1st bonding pad on three types of gold wire with diameter 1.0mil from different supplier were finished to analyze the effect of gold wire type on the low-looped bonding ability, and an optimizing gold wire type was selected