Title :
Mechanical characteristics and high temperature stability of oxidized Ti3AlC2 nanolaminat
Author :
Prikhna, Tatiana ; Ostash, Orest ; Basyuk, Tetiana ; Ivasyshin, Andriy ; Podhurska, V. ; Loshak, Matvey ; Cabioc´h, Thierry ; Chartier, Patrick ; Sverdun, Vladimir ; Moshchil, Viktor ; Dub, Sergey ; Karpets, Myroslav ; Starostina, Alexandra ; Kozyrev, Art
Author_Institution :
Inst. for Superhard Mater., Kiev, Ukraine
Abstract :
The oxide film formed on the surface of the highly dense (ρ=4.27 g/cm3, porosity 1 %) material based on nanolaminated MAX phase Ti3AlC2 (89 % Ti3AlC2, 6 % TiC, 5 % Al2O3) manufactured by hot pressing (at 30 MPa) made the material highly resistant in air at high temperatures: after 1000 hours of exposition at 600 °C it demonstrated a higher resistance to oxidation than chromium ferrite steels (Crofer GPU and JDA types). Due to the surface oxidation self-healing of defects took place. Besides, the Ti3AlC2 material demonstrated resistance against high-temperature creep and after being kept in H2 at 600 °C for 3h its bending strength reduced by 5 % only. At room temperature the Ti3AlC2 bulk exhibited microhardness Hμ = 4.6 GPa (at 5 N), hardness HV50 = 630 (at 50 N ) and HRA = 70 (at 600 N), Young modulus was 140 ± 29 GPa, bending strength =500 MPa, compression strength 700 MPa, and fracture toughness K1C=10.2 MPa·m0.5.
Keywords :
Young´s modulus; aluminium compounds; bending strength; creep; fracture toughness; hot pressing; laminates; microhardness; nanostructured materials; oxidation; titanium compounds; Ti3AlC; Young modulus; bending strength; chromium ferrite steels; compression strength; fracture toughness; high temperature creep; high temperature stability; hot pressing; microhardness; oxidation resistance; oxide film; oxidized nanolaminate; surface oxidation self healing; temperature 600 degC; time 3 h; Heat engines; Solids; MAX phase Ti3AlC2; high- temperature resistance; mechanical characteristics; oxide film;
Conference_Titel :
Oxide Materials for Electronic Engineering (OMEE), 2014 IEEE International Conference on
Conference_Location :
Lviv
Print_ISBN :
978-1-4799-5960-0
DOI :
10.1109/OMEE.2014.6912349