Micro jet array heat sink for power electronics

This work presents the fabrication and testing of a silicon heat-sinking device using a micro jet array principle for distribution of cooling air. The fabrication was done using deep RIE on a set of four 400 /spl mu/m thick silicon wafers. The four device components resulting after wafer dicing were assembled using fast setting epoxy. Testing of the cooling device was performed by studying the behavior of a IRFZ34 power MOSFET cooled with the micro jet array for drain currents between 1 and 7 A, and for air flow rates between 6.5 and 31 1/min. The junction temperature was monitored using the Zener diode from the structure of the transistor.