• DocumentCode
    2577642
  • Title

    Micro heat exchanger by using MEMS impinging jets

  • Author

    Wu, S. ; Mai, J. ; Tai, Y.C. ; Ho, C.M.

  • Author_Institution
    Dept. of Electr. Eng., California Inst. of Technol., Pasadena, CA, USA
  • fYear
    1999
  • fDate
    21-21 Jan. 1999
  • Firstpage
    171
  • Lastpage
    176
  • Abstract
    A micro impinging-jet heat exchanger is presented. Heat transfer is studied for single jet, slot arrays and jet arrays. In order to facilitate micro heat transfer measurements with these devices, a MEMS sensor chip, which has an 8/spl times/8 temperature-sensor array on one side, and an integrated heater on the other side has been designed and fabricated. This sensor chip allows 2-D surface temperature measurement with various jets impinging on it. It is found that micro impinging jets can be highly efficient when compared to existing macro impinging-jet microelectronics packages such as IBM 4381. For example, using a single nozzle jet (500-/spl mu/m diameter driven by 5 psig pressure), the sensor chip (2/spl times/2 cm/sup 2/) temperature can be cooled down from 70 to 33/spl deg/C. The cooling becomes more efficient when nozzle arrays (4/spl times/5 over 1 cm/sup 2/ area) are used under the same driving pressure. Interestingly, although higher driving pressure gives better cooling (lower surface temperature), the cooling efficiency, defined as h/0.5 /spl rho//spl nu//sup 2/, is actually higher for lower driving pressure.
  • Keywords
    arrays; cooling; heat exchangers; heat sinks; jets; microfluidics; microsensors; nozzles; temperature distribution; temperature sensors; thermal management (packaging); 2D surface temperature measurement; 500 micron; 70 to 33 C; MEMS impinging jets; MEMS sensor chip; Parylene layer; Si; chip cooling; cooling efficiency; driving pressure; heat transfer; integrated heater; jet arrays; micro heat exchanger; micro-cooling; microelectronics packages; nozzle arrays; nozzle diameter; nozzle spacing; polysilicon heater; single jet; slot arrays; temperature distribution; temperature-sensor array; Cooling; Heat transfer; Microelectronics; Micromechanical devices; Packaging; Semiconductor device measurement; Sensor arrays; Temperature measurement; Temperature sensors; Thermal sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
  • Conference_Location
    Orlando, FL, USA
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5194-0
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1999.746799
  • Filename
    746799