DocumentCode
2577878
Title
The art of optoelectronic packaging
Author
Pietralunga, Silvia M. ; Pianciola, Aurelio ; Romagnoli, Marco ; Martinelli, Mario
Author_Institution
CoreCom, Milan
Volume
4
fYear
2008
fDate
22-26 June 2008
Firstpage
120
Lastpage
122
Abstract
Optoelectronic packaging is the art of turning well-performing demonstrators of working principles into real devices, so as to guarantee required performances, reliability and cost-effectiveness. To this complex aim, packaging leads many heterogeneous disciplines to convergence, spanning from optics to mechanics, to electronics and material science. Optoelectronic packaging issues and solutions strongly differ, depending on the nature of the system to be implemented and on its level of integration. Three different cases of optical systems for telecomm applications will be discussed, respectively representing on-package integration, on-board hybrid integration and on-chip integration of a monolithic silicon-optics subsystem.
Keywords
electronics packaging; optoelectronic devices; monolithic silicon-optics subsystem; on-board hybrid integration; on-chip integration; on-package integration; optical systems; optoelectronic packaging; telecomm applications; Art; Consumer electronics; Electronic packaging thermal management; Electronics packaging; High speed optical techniques; Integrated optics; Materials science and technology; Optical design; Optical filters; Technological innovation; hybrid integration; on-package integration; optoelectronic packaging; photonic integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Transparent Optical Networks, 2008. ICTON 2008. 10th Anniversary International Conference on
Conference_Location
Athens
Print_ISBN
978-1-4244-2625-6
Electronic_ISBN
978-1-4244-2626-3
Type
conf
DOI
10.1109/ICTON.2008.4598749
Filename
4598749
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