• DocumentCode
    2577878
  • Title

    The art of optoelectronic packaging

  • Author

    Pietralunga, Silvia M. ; Pianciola, Aurelio ; Romagnoli, Marco ; Martinelli, Mario

  • Author_Institution
    CoreCom, Milan
  • Volume
    4
  • fYear
    2008
  • fDate
    22-26 June 2008
  • Firstpage
    120
  • Lastpage
    122
  • Abstract
    Optoelectronic packaging is the art of turning well-performing demonstrators of working principles into real devices, so as to guarantee required performances, reliability and cost-effectiveness. To this complex aim, packaging leads many heterogeneous disciplines to convergence, spanning from optics to mechanics, to electronics and material science. Optoelectronic packaging issues and solutions strongly differ, depending on the nature of the system to be implemented and on its level of integration. Three different cases of optical systems for telecomm applications will be discussed, respectively representing on-package integration, on-board hybrid integration and on-chip integration of a monolithic silicon-optics subsystem.
  • Keywords
    electronics packaging; optoelectronic devices; monolithic silicon-optics subsystem; on-board hybrid integration; on-chip integration; on-package integration; optical systems; optoelectronic packaging; telecomm applications; Art; Consumer electronics; Electronic packaging thermal management; Electronics packaging; High speed optical techniques; Integrated optics; Materials science and technology; Optical design; Optical filters; Technological innovation; hybrid integration; on-package integration; optoelectronic packaging; photonic integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transparent Optical Networks, 2008. ICTON 2008. 10th Anniversary International Conference on
  • Conference_Location
    Athens
  • Print_ISBN
    978-1-4244-2625-6
  • Electronic_ISBN
    978-1-4244-2626-3
  • Type

    conf

  • DOI
    10.1109/ICTON.2008.4598749
  • Filename
    4598749