CAD modeling of MIC multiport power combiners/dividers fabricated on the base of extended concept of hybrid ring structure

The results of theoretical and experimental studies of symmetrical power dividers in integrated microstrip-line based planar technology are shown and concluded. The presented work focuses on the application of a well-known hybrid power combiner/divider. A modified version of the original structure is proposed to achieve enhanced performance of in-phase power divider around the mid-band frequency for classical 3-dB structures. The concept is then further extended on the modeling of different multiport combiners/dividers in either an in- or anti-phase mode of excitation. The achievements of this study demonstrate the accuracy of the applied simulation tools as well as the potential utility of the analyzed structures for the construction of quality integrated planar integrated circuits such as balanced components and multi-element feeders