Title :
The Technique Research on LTCC 3D-MCM
Author :
Jianhui, Li ; Zhaowen, Dong ; Bangchao, Yang
Author_Institution :
Res. Inst. of China, Electron. Technol. Corp., Anhui
Abstract :
Three-dimensional MCM (3D-MCM) is an effective method for realizing high-density assembly. In this paper, the fabrications of spacer and solder bumps, the process technology of stacked package for multi-substrates and spacer, as well as the vertical interconnection technology in research of LTCC 3D-MCM are introduced. And also the void of solder bump, the false soldering between vertical interconnection, solder choice for different soldering area in 3D-MCM are analyzed and discussed
Keywords :
ceramics; interconnections; microassembling; multichip modules; solders; LTCC 3D-MCM; high-density assembly; solder bumps fabrication; spacer fabrication; vertical interconnection technology; Assembly; Electronics packaging; Fabrication; Integrated circuit interconnections; Military computing; Printing; Soldering; Space technology; Substrates; Thermal stresses;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359653
