The Reliability Research of Lead-Free Solder Joint of Flip-Chip

Author

De-jin, Yan ; De-jian, Zhou ; Chun-yue, Huang ; Zhao-hua, Wu ; Xiang, Zhou

Author_Institution

Dept. of Electron. Machinery & Traffic Eng., GuiLin Univ. of Electron. Technol.

fYear

2006

fDate

26-29 Aug. 2006

Firstpage

1

Lastpage

5

Abstract

Based on the minimum potential energy theorem and the theory of solder joint shape, 3D (three-dimensional) predicting model of flip-chip lead-free solder joints shape are established. According to different technologic parameters, the 3D solder joint shape is predicted. The nonlinear finite element analyses of the lead-free solder joint is performed by ANSYS under thermal cycles and the stress/strain distributions within the key solder joints and the maximum plastic strain range of the solder joints are determined. Based on the calculated maximum plastic strain range, the thermal fatigue life of the Sn96.5-Ag3.5 and Sn95.5-Ag3.8-Cu0.7 solder joints are calculated using Coffin-Manson equation. Based on the results of the calculated thermal fatigue life, the rules influencing thermal fatigue life of lead-free solder joints under the different technologic parameters are derived, which can be used in the hatch design of stencil and the dimension design of pad

Keywords

copper alloys; finite element analysis; flip-chip devices; integrated circuit packaging; reliability; silver alloys; solders; tin alloys; 3D predicting model; ANSYS; Coffin-Manson equation; SnAgCu; flip-chip; lead-free solder joint; minimum potential energy theorem; nonlinear finite element analyses; reliability; solder joint shape theory; strain distributions; stress distributions; thermal fatigue life; Capacitive sensors; Environmentally friendly manufacturing techniques; Fatigue; Lead; Plastics; Potential energy; Predictive models; Shape; Soldering; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on

Conference_Location

Shanghai

Print_ISBN

1-4244-0619-6

Electronic_ISBN

1-4244-0620-X

Type

conf

DOI

10.1109/ICEPT.2006.359656

Filename

4199014