Title :
The Challenges of Nanoelectronics for Reliability
Author_Institution :
Delft Univ. of Technol., Delft
Abstract :
Microelectronics has pervaded our lives for the past fifty years. The shift from the era of microelectronics, where semiconductor devices were measured in microns to the new era of nanoelectronics where they shrink to dimensions measured in nanometers, will make the semiconductors even more pervasive than it is today. However, the evolution of microelectronics to nanoelectronics brings not only promising applications, but also a lot of challenges for reliability. The success of this shift, to some extend, depends on the solutions for these reliability challenges.
Keywords :
integrated circuit reliability; nanoelectronics; microelectronics; nanoelectronics; reliability; semiconductor devices; Assembly; Chemical technology; Chemistry; Integrated circuit packaging; Microelectronics; Nanoelectronics; Semiconductor device measurement; Semiconductor devices; Wafer scale integration; Wire;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359666