DocumentCode
2578237
Title
The Challenges of Nanoelectronics for Reliability
Author
Zhang, G.Q.
Author_Institution
Delft Univ. of Technol., Delft
fYear
2006
fDate
26-29 Aug. 2006
Firstpage
1
Lastpage
3
Abstract
Microelectronics has pervaded our lives for the past fifty years. The shift from the era of microelectronics, where semiconductor devices were measured in microns to the new era of nanoelectronics where they shrink to dimensions measured in nanometers, will make the semiconductors even more pervasive than it is today. However, the evolution of microelectronics to nanoelectronics brings not only promising applications, but also a lot of challenges for reliability. The success of this shift, to some extend, depends on the solutions for these reliability challenges.
Keywords
integrated circuit reliability; nanoelectronics; microelectronics; nanoelectronics; reliability; semiconductor devices; Assembly; Chemical technology; Chemistry; Integrated circuit packaging; Microelectronics; Nanoelectronics; Semiconductor device measurement; Semiconductor devices; Wafer scale integration; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location
Shanghai
Print_ISBN
1-4244-0619-6
Electronic_ISBN
1-4244-0620-X
Type
conf
DOI
10.1109/ICEPT.2006.359666
Filename
4199024
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