DocumentCode :
2578237
Title :
The Challenges of Nanoelectronics for Reliability
Author :
Zhang, G.Q.
Author_Institution :
Delft Univ. of Technol., Delft
fYear :
2006
fDate :
26-29 Aug. 2006
Firstpage :
1
Lastpage :
3
Abstract :
Microelectronics has pervaded our lives for the past fifty years. The shift from the era of microelectronics, where semiconductor devices were measured in microns to the new era of nanoelectronics where they shrink to dimensions measured in nanometers, will make the semiconductors even more pervasive than it is today. However, the evolution of microelectronics to nanoelectronics brings not only promising applications, but also a lot of challenges for reliability. The success of this shift, to some extend, depends on the solutions for these reliability challenges.
Keywords :
integrated circuit reliability; nanoelectronics; microelectronics; nanoelectronics; reliability; semiconductor devices; Assembly; Chemical technology; Chemistry; Integrated circuit packaging; Microelectronics; Nanoelectronics; Semiconductor device measurement; Semiconductor devices; Wafer scale integration; Wire;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
Type :
conf
DOI :
10.1109/ICEPT.2006.359666
Filename :
4199024
Link To Document :
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