• DocumentCode
    2578237
  • Title

    The Challenges of Nanoelectronics for Reliability

  • Author

    Zhang, G.Q.

  • Author_Institution
    Delft Univ. of Technol., Delft
  • fYear
    2006
  • fDate
    26-29 Aug. 2006
  • Firstpage
    1
  • Lastpage
    3
  • Abstract
    Microelectronics has pervaded our lives for the past fifty years. The shift from the era of microelectronics, where semiconductor devices were measured in microns to the new era of nanoelectronics where they shrink to dimensions measured in nanometers, will make the semiconductors even more pervasive than it is today. However, the evolution of microelectronics to nanoelectronics brings not only promising applications, but also a lot of challenges for reliability. The success of this shift, to some extend, depends on the solutions for these reliability challenges.
  • Keywords
    integrated circuit reliability; nanoelectronics; microelectronics; nanoelectronics; reliability; semiconductor devices; Assembly; Chemical technology; Chemistry; Integrated circuit packaging; Microelectronics; Nanoelectronics; Semiconductor device measurement; Semiconductor devices; Wafer scale integration; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-0619-6
  • Electronic_ISBN
    1-4244-0620-X
  • Type

    conf

  • DOI
    10.1109/ICEPT.2006.359666
  • Filename
    4199024