Title :
Heterogeneous Integration: The Bridge between Micro/Nanoelectronics and Application
Author :
Aschenbrenner, Rolf
Author_Institution :
Fraunhofer IZM, Berlin
Abstract :
In this paper, research priorities and demands of future products for heterogeneous system integration technology are presented. Heterogeneous Integration technologies ensures the integration of different functionalities such as signal processing, sensors, actuators, photonics, power, and coolers, that is specifically adopted to the application environments. Heterogeneous integration technologies are bridging the gap between nanoelectronics and the application system.
Keywords :
actuators; integrated circuit packaging; integrated optoelectronics; nanoelectronics; sensors; actuators; electronics packaging technology; heterogeneous system integration; microelectronics; nanoelectronics; photonics; sensors; signal processing; Bridges; Costs; Data processing; Material storage; Microelectronics; Nanoelectronics; Optical sensors; Packaging; Signal processing; System-on-a-chip;
Conference_Titel :
Electronic Packaging Technology, 2006. ICEPT '06. 7th International Conference on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-0619-6
Electronic_ISBN :
1-4244-0620-X
DOI :
10.1109/ICEPT.2006.359669
