DocumentCode
2578705
Title
Keeping Both Sides Winning: Wafer Fabrication Equipment Suppliers And Semiconductor Manufacturers In The Year 2000 And Beyond
Author
Maydan, D.
Author_Institution
Applied Materials, Inc. 3050 Bowers Avenue Santa Clara, California 95054
fYear
1997
fDate
10-12 June 1997
Firstpage
5
Lastpage
7
Abstract
Global demand for semiconductor IC solutions has kept both semiconductor manufacturers and wafer fabrication equipment suppliers in a state of rapid growth since the 1970\´s. As the next century approaches, new manufacturing challenges arise due to decreasing feature sizes, increasing metal layers, and the transition to 300" wafer size. Technology and productivity shifts such as these represent tremendous economic risks for both semiconductor manufacturers and equipment suppliers. This paper will briefly discuss historical drivers of growth for both semiconductor manufacturers and equipment suppliers, examine semiconductor manufacturers\´ priorities for the year 2000 and beyond, discuss equipment trends for the 2lSt century, and highlight winning strategies for the next century for wafer processing.
Keywords
Integrated circut design; Semiconductor devices; Wafer processing;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1997. Digest of Technical Papers., 1997 Symposium on
Print_ISBN
4-930813-75-1
Type
conf
DOI
10.1109/VLSIT.1997.623668
Filename
623668
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