• DocumentCode
    2578705
  • Title

    Keeping Both Sides Winning: Wafer Fabrication Equipment Suppliers And Semiconductor Manufacturers In The Year 2000 And Beyond

  • Author

    Maydan, D.

  • Author_Institution
    Applied Materials, Inc. 3050 Bowers Avenue Santa Clara, California 95054
  • fYear
    1997
  • fDate
    10-12 June 1997
  • Firstpage
    5
  • Lastpage
    7
  • Abstract
    Global demand for semiconductor IC solutions has kept both semiconductor manufacturers and wafer fabrication equipment suppliers in a state of rapid growth since the 1970\´s. As the next century approaches, new manufacturing challenges arise due to decreasing feature sizes, increasing metal layers, and the transition to 300" wafer size. Technology and productivity shifts such as these represent tremendous economic risks for both semiconductor manufacturers and equipment suppliers. This paper will briefly discuss historical drivers of growth for both semiconductor manufacturers and equipment suppliers, examine semiconductor manufacturers\´ priorities for the year 2000 and beyond, discuss equipment trends for the 2lSt century, and highlight winning strategies for the next century for wafer processing.
  • Keywords
    Integrated circut design; Semiconductor devices; Wafer processing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1997. Digest of Technical Papers., 1997 Symposium on
  • Print_ISBN
    4-930813-75-1
  • Type

    conf

  • DOI
    10.1109/VLSIT.1997.623668
  • Filename
    623668