DocumentCode
2578720
Title
Wireless micromachined ceramic pressure sensors
Author
English, J.M. ; Allen, M.G.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
fYear
1999
fDate
21-21 Jan. 1999
Firstpage
511
Lastpage
516
Abstract
In high temperature applications, such as pressure sensing in turbine engines and compressors, high-temperature materials and data retrieval methods are required. The microelectronics packaging infrastructure provides well-developed, high temperature ceramic materials, processing tools, and processing techniques that have the potential for applicability in high temperature sensors. A completely passive wireless telemetry scheme, which relies on a frequency shift output, has been integrated with the sensors, thereby eliminating the need for contacts, active elements, or power supplies to be contained within the sensor. This simplicity of sensor design allows the sensor to be exposed to elevated temperatures. As a proof-of concept, a wireless micromachined ceramic pressure sensor has been designed, fabricated, tested, and, compared with theoretical models. Sensors have been operated up to 200/spl deg/C and in pressure ranges from 0-1 bar and from 0-100 bar. The measured sensitivity of a fabricated sensor, expressed in frequency shift per pressure difference, is 2.6 MHz/bar, which compares well to the theoretically determined sensitivity of 2.2 MHz/bar.
Keywords
ceramic packaging; high-temperature techniques; micromachining; microsensors; pressure sensors; radiotelemetry; 0 to 1 bar; 0 to 100 bar; 200 C; ceramic pressure sensor; high temperature operation; microelectronics packaging; micromachining; passive wireless telemetry; Ceramics; Compressors; Engines; Frequency; Information retrieval; Microelectronics; Packaging; Temperature sensors; Turbines; Wireless sensor networks;
fLanguage
English
Publisher
ieee
Conference_Titel
Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
Conference_Location
Orlando, FL, USA
ISSN
1084-6999
Print_ISBN
0-7803-5194-0
Type
conf
DOI
10.1109/MEMSYS.1999.746881
Filename
746881
Link To Document