• DocumentCode
    2578720
  • Title

    Wireless micromachined ceramic pressure sensors

  • Author

    English, J.M. ; Allen, M.G.

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    1999
  • fDate
    21-21 Jan. 1999
  • Firstpage
    511
  • Lastpage
    516
  • Abstract
    In high temperature applications, such as pressure sensing in turbine engines and compressors, high-temperature materials and data retrieval methods are required. The microelectronics packaging infrastructure provides well-developed, high temperature ceramic materials, processing tools, and processing techniques that have the potential for applicability in high temperature sensors. A completely passive wireless telemetry scheme, which relies on a frequency shift output, has been integrated with the sensors, thereby eliminating the need for contacts, active elements, or power supplies to be contained within the sensor. This simplicity of sensor design allows the sensor to be exposed to elevated temperatures. As a proof-of concept, a wireless micromachined ceramic pressure sensor has been designed, fabricated, tested, and, compared with theoretical models. Sensors have been operated up to 200/spl deg/C and in pressure ranges from 0-1 bar and from 0-100 bar. The measured sensitivity of a fabricated sensor, expressed in frequency shift per pressure difference, is 2.6 MHz/bar, which compares well to the theoretically determined sensitivity of 2.2 MHz/bar.
  • Keywords
    ceramic packaging; high-temperature techniques; micromachining; microsensors; pressure sensors; radiotelemetry; 0 to 1 bar; 0 to 100 bar; 200 C; ceramic pressure sensor; high temperature operation; microelectronics packaging; micromachining; passive wireless telemetry; Ceramics; Compressors; Engines; Frequency; Information retrieval; Microelectronics; Packaging; Temperature sensors; Turbines; Wireless sensor networks;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
  • Conference_Location
    Orlando, FL, USA
  • ISSN
    1084-6999
  • Print_ISBN
    0-7803-5194-0
  • Type

    conf

  • DOI
    10.1109/MEMSYS.1999.746881
  • Filename
    746881