DocumentCode :
2578911
Title :
A robust micro conveyer realized by arrayed polyimide joint actuators
Author :
Ebefors, T. ; Mattsson, J.U. ; Kalvesten, E. ; Stemme, G.
Author_Institution :
Dept. of Signals, Sensors & Syst., R. Inst. of Technol., Stockholm, Sweden
fYear :
1999
fDate :
21-21 Jan. 1999
Firstpage :
576
Lastpage :
581
Abstract :
A new micro motion system (micro-conveyer) based on arrays of movable robust silicon legs has been developed and investigated. The motion is achieved by thermal actuation of polyimide joint actuators using electrical heating. Successful experiments on moving flat objects in the millimeter range with high load capacity have been performed. The conveyer consists of a 15/spl times/5 mm/sup 2/ chip with 12 silicon legs each 500 /spl mu/m long. The maximum load conveyed on the structure was 2000 mg. Conveyance velocities up to 12 mm/s have been measured. Accelerated lifetime measurements demonstrate the long-term stability of the actuators. The function of the polyimide joint actuators is unaffected after more than 2/spl times/10/sup 8/ load cycles.
Keywords :
conveyors; industrial manipulators; legged locomotion; mechanical stability; microactuators; microassembling; micromachining; micropositioning; microrobots; 15 mm; 2000 mg; 2D system; 5 mm; 500 micron; Si; accelerated lifetime measurements; arrayed polyimide joint actuators; assembling tools; bending angle; chip and wafer handling; conveyance velocity; electrical heating; electrostatic actuation; fabrication; high load capacity; long-term stability; manipulation strategies; mechanical failure mechanism; micro motion system; millimeter range; movable robust silicon legs; moving flat objects; multi-legged motion; piezoelectric actuation; positioning accuracy; robust micro-conveyer; thermal actuation; thermal failure mechanism; Acceleration; Actuators; Leg; Lifetime estimation; Polyimides; Resistance heating; Robustness; Semiconductor device measurement; Silicon; Velocity measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Micro Electro Mechanical Systems, 1999. MEMS '99. Twelfth IEEE International Conference on
Conference_Location :
Orlando, FL, USA
ISSN :
1084-6999
Print_ISBN :
0-7803-5194-0
Type :
conf
DOI :
10.1109/MEMSYS.1999.746892
Filename :
746892
Link To Document :
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