DocumentCode
2579138
Title
Fabrication of nickel electroplated cantilever-type MEMS probe card with through-hole interconnection
Author
Bong-Hwan Kim ; Sang-Jun Park ; Dong-Il Cho ; Kukjin Chun
Author_Institution
Sch. of Electr. Eng., Seoul Nat. Univ., South Korea
fYear
2003
fDate
29-31 Oct. 2003
Firstpage
170
Lastpage
171
Abstract
In this paper, a new cantilever type MEMS probe card for IC testing was developed. The probe was fabricated with silicon substrate.
Keywords
contact resistance; electroplating; integrated circuit testing; leakage currents; micromechanical devices; nickel; probes; IC testing; Ni; Si; hole interconnection; nickel electroplated cantilever-type MEMS probe card; silicon substrate; Circuit testing; Copper; Etching; Fabrication; Integrated circuit interconnections; Integrated circuit testing; Micromechanical devices; Nickel; Probes; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Microprocesses and Nanotechnology Conference, 2003. Digest of Papers. 2003 International
Conference_Location
Tokyo, Japan
Print_ISBN
4-89114-040-2
Type
conf
DOI
10.1109/IMNC.2003.1268629
Filename
1268629
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