• DocumentCode
    2579402
  • Title

    Online design bug detection: RTL analysis, flexible mechanisms, and evaluation

  • Author

    Constantinides, Kypros ; Mutlu, Onur ; Austin, Todd

  • Author_Institution
    Adv. Comput. Archit. Lab., Univ. of Michigan, MI
  • fYear
    2008
  • fDate
    8-12 Nov. 2008
  • Firstpage
    282
  • Lastpage
    293
  • Abstract
    Higher level of resource integration and the addition of new features in modern multi-processors put a significant pressure on their verification. Although a large amount of resources and time are devoted to the verification phase of modern processors, many design bugs escape the verification process and slip into processors operating in the field. These design bugs often lead to lower quality products, lower customer satisfaction, diminishing brand/company reputation, or even expensive product recalls. This paper proposes a flexible, low-overhead mechanism to detect the occurrence of design bugs during on-line operation. First, we analyze the actual design bugs found and fixed in a commercial chip- multiprocessor, Sun´s OpenSPARC Tl, to understand the behavior and characteristics of design bugs. Our RTL analysis of design bugs shows that the number of signals that need to be monitored to detect design bugs is significantly larger than suggested by previous studies that analyzed design bugs at a higher level using processor errata sheets. Second, based on the insights obtained from our analyses, we propose a programmable, distributed online design bug detection mechanism that incorporates the monitoring of bugs into the flip-flops of the design. The key contribution of our mechanism is its ability to monitor all control signals in the design rather than a set of signals selected at design time. As a result, it is very flexible: when a bug is discovered after the processor is shipped, it can be detected by monitoring the set of control signals that trigger the design bug. We develop an RTL prototype implementation of our mechanism on the OpenSPARC Tl chip multiprocessor. We found its area overhead to be 10% and its power consumption overhead to be 3.5% over the whole OpenSPARC Tl chip.
  • Keywords
    flip-chip devices; formal verification; integrated circuit design; integrated circuit testing; microprocessor chips; RTL analysis; Sun´s OpenSPARC Tl; distributed online design bug detection mechanism; flip-flops; low-overhead mechanism; modern multiprocessors; processor errata sheets; resource integration; verification process; Computer bugs; Customer satisfaction; Flip-flops; Monitoring; Process design; Prototypes; Signal analysis; Signal design; Signal processing; Sun;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microarchitecture, 2008. MICRO-41. 2008 41st IEEE/ACM International Symposium on
  • Conference_Location
    Lake Como
  • ISSN
    1072-4451
  • Print_ISBN
    978-1-4244-2836-6
  • Electronic_ISBN
    1072-4451
  • Type

    conf

  • DOI
    10.1109/MICRO.2008.4771798
  • Filename
    4771798