DocumentCode
2580538
Title
Biomechanics at the micro scale
Author
Tang, William C.
Author_Institution
Dept. of Biomed. Eng., California Univ., Irvine, CA, USA
fYear
2005
fDate
15-16 Aug. 2005
Abstract
Micro-electro-mechanical systems (MEMS) technology was applied to study the mechanical aspects of biological tissues at the micro scale, one for in vitro use and the other for in vivo. Microfabricated platforms have been developed to investigate the effect of mechanical stress on neurogenesis in vitro. These platforms are designed to exert mechanical tension along radial glial processes between groups of neural stem cells to study the effect of tension on cerebral cortex neurogenesis. The use of MEMS enables a high-precision application of quantifiable stresses on the sample under investigation, and thus will better enable in-depth study on the correlation of stress and neuron growth. For in vivo study, micro strain sensor arrays have been developed to enable the investigation of bones in healthy or cancerous states or in the presence of bone implants. These implantable micro strain sensors are fabricated on a flexible substrate to allow conformal attachment onto the curved bone surfaces, while providing high-resolution mechanical data in real time.
Keywords
biological tissues; biomechanics; biomedical engineering; biosensors; micromechanical devices; neural nets; orthopaedics; strain sensors; biological tissues; biomechanics; bone implants; cerebral cortex neurogenesis; curved bone surfaces; flexible substrate; mechanical stress; mechanical tension; microelectro-mechanical systems technology; microfabricated platforms; microstrain sensor arrays; neural stem cells; neuron growth; orthopaedics; radial glial processes; strain gauge arrays; Biomechanics; Bones; Capacitive sensors; In vitro; In vivo; Mechanical sensors; Microelectromechanical systems; Micromechanical devices; Sensor arrays; Stress;
fLanguage
English
Publisher
ieee
Conference_Titel
Emerging Information Technology Conference, 2005.
Print_ISBN
0-7803-9328-7
Type
conf
DOI
10.1109/EITC.2005.1544335
Filename
1544335
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