Numerical and experimental investigation of heat transfer phenomena over an electronic module

Summary form only given. In the numerical approach, the time-averaged equations depicting the turbulent flow field were integrated using a commercial finite-difference code (PHOENICS). The card-mounted electronic module was represented as a conducting solid. The resulting heat transfer coefficient data were used as boundary conditions for subsequent conduction analyses of the package. The CAEDS program, a commercially available finite-element simulation system, was used to perform the conduction simulation. Heat-transfer coefficient, surface temperature, pressure drop and overall thermal resistance (external and internal) data are presented as a function of fluid velocity. Experimental data were acquired for individual components surface-mounted to small sections of epoxy circuit card. Custom thermal chips were used to simulate power dissipation and sense bulk chip temperature. The test vehicles were placed in individual rectangular channels and exposed to uniform air flow over a Reynolds number range from 300 to 11000. Component surface temperatures, air temperature, and chip temperature were measured, and the results were compared with those of the simulations