Title :
Fine pattern etching of silicon substrates by using atmospheric line shaped micro plasma source
Author :
Okumura, T. ; Saitoh, M. ; Matsuda, I.
Author_Institution :
Production Core Eng. Lab., Matsushita Electr. Ind. Co. Ltd., Kadoma, Japan
Abstract :
In this paper, various micro plasma sources have been proposed. We have already proposed two types of line shaped micro plasma sources. This report presents a new type of line shaped micro plasma source for finer processing than the former two types and its application to fine pattern etching of a silicon substrate.
Keywords :
elemental semiconductors; plasma sources; silicon; sputter etching; Si; atmospheric line shaped micro plasma source; fine pattern etching; silicon substrates; Ceramics; Chemical technology; Costs; Electrodes; Etching; Feeds; Fluid flow; Plasma sources; Silicon; Substrates;
Conference_Titel :
Microprocesses and Nanotechnology Conference, 2003. Digest of Papers. 2003 International
Conference_Location :
Tokyo, Japan
Print_ISBN :
4-89114-040-2
DOI :
10.1109/IMNC.2003.1268781
