• DocumentCode
    2581777
  • Title

    GaAs-on-Si: a GaAs IC manufacturer´s perspective

  • Author

    Wilson, Mark R. ; Shen, Y.D. ; Welch, B.M. ; Lee, Jae W. ; McCullough, R.E. ; Salerno, J.P. ; Fan, J.C.C.

  • Author_Institution
    GigaBit Logic Inc., Newbury, CA, USA
  • fYear
    1988
  • fDate
    6-9 Nov. 1988
  • Firstpage
    243
  • Lastpage
    246
  • Abstract
    The performance, yield, and reliability of GaAs ICs (integrated circuits) fabricated on OMCVD (organometallic chemical-vapor-deposition)-grown GaAs-on-Si substrates are described. These substrates were used to fabricate MSI-level digital ICs (integrated circuits) in a manufacturing environment. They were processed together with LEC (liquid-encapsulated Czochralski)-grown GaAs wafers to provide a direct comparison with bulk material. Initial evaluations of devices and circuits suggest that it is realistic to believe that GaAs-on-Si substrates can be a viable alternative to LEC-grown GaAs materials. In addition, a two-part reliability study has demonstrated that GaAs-on-Si parts have no liabilities in terms of parametric instability or catastrophic failure mechanisms. However, there are epitaxial growth conditions which must be optimized further to obtain performance which is not inferior to bulk GaAs materials.<>
  • Keywords
    CVD coatings; III-V semiconductors; circuit reliability; digital integrated circuits; monolithic integrated circuits; GaAs; GaAs-Si; LEC; MSI-level digital ICs; OMCVD; catastrophic failure mechanisms; epitaxial growth conditions; parametric instability; performance; reliability; yield; Chemicals; Digital integrated circuits; Epitaxial growth; Failure analysis; Gallium arsenide; Integrated circuit manufacture; Integrated circuit reliability; Integrated circuit yield; Manufacturing; Substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Gallium Arsenide Integrated Circuit (GaAs IC) Symposium, 1988. Technical Digest 1988., 10th Annual IEEE
  • Conference_Location
    Nashville, Tennessee, USA
  • Type

    conf

  • DOI
    10.1109/GAAS.1988.11067
  • Filename
    11067