Comparison of stress distributions and failure modes during thermal cycling and power cycling on high power IGBT modules

Author

Bouarroudj, M. ; Khatir, Z. ; Ousten, J.P. ; Dupont, Laurent ; Lefebvre, Serge ; Badel, F.

Author_Institution

INRETS-LTN, Arcueil

fYear

2007

fDate

2-5 Sept. 2007

Firstpage

1

Lastpage

10

Abstract

The paper presents experimental investigations on both power and thermal cycling conditions on 600 V-200 A six-pack IGBT power modules. Both types of cycles are compared in term of thermo- mechanical stresses by using finite element simulations. Finally, combined stresses are simulated in order to assess the real conditions of use of these devices in automotive applications.

Keywords

automotive components; finite element analysis; insulated gate bipolar transistors; automotive applications; current 200 A; failure modes; finite element simulations; high power IGBT modules; power cycling; stress distributions; thermal cycling; thermo-mechanical stresses; voltage 600 V; Automotive applications; Electronic packaging thermal management; Finite element methods; Insulated gate bipolar transistors; Multichip modules; Power electronics; Temperature; Testing; Thermal stresses; Thermomechanical processes; Automotive Application; High temperature electronics; Hybrid Power Integration; IGBT; Packaging; Power cycling; Power electronic modules; Thermal cycling;

fLanguage

English

Publisher

ieee

Conference_Titel

Power Electronics and Applications, 2007 European Conference on

Conference_Location

Aalborg

Print_ISBN

978-92-75815-10-8

Electronic_ISBN

978-92-75815-10-8

Type

conf

DOI

10.1109/EPE.2007.4417457

Filename

4417457