DocumentCode
2582592
Title
Contribution to the stress grading in integrated power modules
Author
Duchesne, Cyrille ; Lebey, Thierry ; Mermet-Guyennet, Michel ; Dutarde, Emmanuel ; Dagdag, Selim
Author_Institution
Power Electron. Assoc. Res. Lab., Semeac
fYear
2007
fDate
2-5 Sept. 2007
Firstpage
1
Lastpage
9
Abstract
Power electronics packaging, like integrated power modules, constitute an advanced technology leading to power density increase, weight and volume decrease and enhancing the reliability level. However, the continuous increase of the voltage lead to questions regarding power device environment. We discuss in the following different solutions able to achieve the electric stress gradation.
Keywords
electronics packaging; power electronics; electric stress gradation; integrated power modules; power density; power electronics packaging; stress grading; Electronics packaging; Insulation; Multichip modules; Permittivity; Power electronics; Rail transportation; Semiconductor materials; Stress; Uniform resource locators; Voltage; Electric field distribution; Hybrid composites; Non-linear characteristics; Triple points; dielectric strength;
fLanguage
English
Publisher
ieee
Conference_Titel
Power Electronics and Applications, 2007 European Conference on
Conference_Location
Aalborg
Print_ISBN
978-92-75815-10-8
Electronic_ISBN
978-92-75815-10-8
Type
conf
DOI
10.1109/EPE.2007.4417459
Filename
4417459
Link To Document