Integration Of Thermally Stable, Low-k AF4 Polymer For 0.18 /spl mu/m Interconnects And Beyond

Author

Ralston, A.R.K. ; Gaynor, J.F. ; Singh, A. ; Le, L.V. ; Havemann, R.H. ; Piano ; Cleary, T.J. ; Wing, J.C. ; Kelly, J.

Author_Institution

Semiconductor Process and Device Center, Texas Instruments, PO Box 655012, MS 461, Dallas, Texas 75265

fYear

1997

fDate

10-12 June 1997

Firstpage

Lastpage

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology, 1997. Digest of Technical Papers., 1997 Symposium on

Print_ISBN

4-930813-75-1

Type

DOI

10.1109/VLSIT.1997.623705

Filename

623705

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