DocumentCode
2583179
Title
Implication And Solutions For Joule Heating In High Performance Interconnects Incorporating Low-k Dielectrics
Author
Shih, W.-Y. ; Chang, M.-C. ; Havemann, R.H. ; Levine, J.
Author_Institution
Semiconductor Process and Device Center, MS 461, Texas Instruments, Dallas, TX 75243
fYear
1997
fDate
10-12 June 1997
Firstpage
83
Lastpage
84
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, 1997. Digest of Technical Papers., 1997 Symposium on
Print_ISBN
4-930813-75-1
Type
conf
DOI
10.1109/VLSIT.1997.623706
Filename
623706
Link To Document